SINGAPORE, January 12 -
Following are terms and conditions of a bond to be issued on January 15, 2009
Borrower Singapore Government
Issue Amount S$1.2 Billion
Issue Code N708100S
Coupon 2.875% p.a
Issue Date January 15, 2009
Maturity Date July 01, 2015
Average yield and price 1.60% p.a and 107.908%
Cut-off yield and price 1.71% p.a and 107.208%
Coupon Payment Dates 01 January and 01 July
Denominations S$1,000
Auction Date January 12, 2009
Method of Sale Uniform-Price Auction
For ratings information, double click on
For all bonds data, double click on
For Top international bonds news [TOP/EUB]
For news about this issuer, double click on the issuer RIC,
where assigned, and hit F9 on Reuters terminals.
Data supplied by International Insider.
Following are terms and conditions of a bond to be issued on January 15, 2009
Borrower Singapore Government
Issue Amount S$1.2 Billion
Issue Code N708100S
Coupon 2.875% p.a
Issue Date January 15, 2009
Maturity Date July 01, 2015
Average yield and price 1.60% p.a and 107.908%
Cut-off yield and price 1.71% p.a and 107.208%
Coupon Payment Dates 01 January and 01 July
Denominations S$1,000
Auction Date January 12, 2009
Method of Sale Uniform-Price Auction
For ratings information, double click on
For all bonds data, double click on
For Top international bonds news [TOP/EUB]
For news about this issuer, double click on the issuer RIC,
where assigned, and hit F9 on Reuters terminals.
Data supplied by International Insider.
