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HUAWEI’s New 4nm Chip Just SHOCKED The World… NO ONE Expected This!
- Thread starter LaoTze
- Start date
https://keshtopatsspace.quora.com/US-Sanctions-Fail-Chinas-First-4nm-Chip-Enters-Commercial-Use
US Sanctions Fail! China's First 4nm Chip Enters Commercial Use.
Recently, the China Supercomputer Research Center announced that it has successfully packaged China's first 4nm chip and applied it to a computer cluster.
This breakthrough marks an important step forward in chip packaging technology in China, opening up new paths for Chinese chip performance. The importance of packaging technology lies in the fact that the current development of advanced processes is approaching a bottleneck.
TSMC and Samsung announced the start of mass production of 3nm processes last year, but Samsung's 3nm process yields are as low as 10-20%, costs are high, and no customers for 3nm processes have been announced yet.
TSMC also began mass production of the 3nm process at the end of last year, but its main customers are expected to be Apple only, and Apple will not start using the process to produce the A17 processor until June.
Unlike the past, this time the 3nm process was delayed by half a year, which some industry insiders believe is due to Apple's limited performance improvement and high cost of TSMC's 3nm process, forcing TSMC to improve to the second generation 3nm process = N3E before it can be adopted. As the development of advanced processes encountered obstacles, many chip companies such as Intel and TSMC jointly developed another way to improve chip performance, namely Chiplet technology.
Chiplet technology is divided into two types, one is the same kind of chip using a special way to package together, such as Apple's M1 Pro MAX, by linking two M1 chips to significantly improve performance; the other is to package the chips of different processes together to improve the overall performance by reducing the communication time between chips.
There are already companies in China developing both Chiplet technologies. A Shenzhen-based technology company has proposed a chip stacking technology that can integrate two 14nm chips to approach the performance of a 7nm process, and has been patented.
Note that the China was buying semiconductors from G-7 nations without any hiccups or hinderance, until Trump & Biden gang rocked this boat.
As soon as self sufficiency increases China will be able to produce chips at a cheaper price. This could drive American chip suppliers out of business altogether!
The US fails to understand that China is no India. China gives surprises. Wait for 2 years more as lithography machines are being build and then you see the fun.
The Chinese electronics Industry will ultimately succeed in the international market enhancing its creativity and competitiveness and driving the entire industry to new heights as a nation China should not passively rely on imported ships and other critical Technologies but gradually achieve independent Innovation and strengthen its core competitiveness through this approach.
US Sanctions Fail! China's First 4nm Chip Enters Commercial Use.
Recently, the China Supercomputer Research Center announced that it has successfully packaged China's first 4nm chip and applied it to a computer cluster.
This breakthrough marks an important step forward in chip packaging technology in China, opening up new paths for Chinese chip performance. The importance of packaging technology lies in the fact that the current development of advanced processes is approaching a bottleneck.
TSMC and Samsung announced the start of mass production of 3nm processes last year, but Samsung's 3nm process yields are as low as 10-20%, costs are high, and no customers for 3nm processes have been announced yet.
TSMC also began mass production of the 3nm process at the end of last year, but its main customers are expected to be Apple only, and Apple will not start using the process to produce the A17 processor until June.
Unlike the past, this time the 3nm process was delayed by half a year, which some industry insiders believe is due to Apple's limited performance improvement and high cost of TSMC's 3nm process, forcing TSMC to improve to the second generation 3nm process = N3E before it can be adopted. As the development of advanced processes encountered obstacles, many chip companies such as Intel and TSMC jointly developed another way to improve chip performance, namely Chiplet technology.
Chiplet technology is divided into two types, one is the same kind of chip using a special way to package together, such as Apple's M1 Pro MAX, by linking two M1 chips to significantly improve performance; the other is to package the chips of different processes together to improve the overall performance by reducing the communication time between chips.
There are already companies in China developing both Chiplet technologies. A Shenzhen-based technology company has proposed a chip stacking technology that can integrate two 14nm chips to approach the performance of a 7nm process, and has been patented.
Note that the China was buying semiconductors from G-7 nations without any hiccups or hinderance, until Trump & Biden gang rocked this boat.
As soon as self sufficiency increases China will be able to produce chips at a cheaper price. This could drive American chip suppliers out of business altogether!
The US fails to understand that China is no India. China gives surprises. Wait for 2 years more as lithography machines are being build and then you see the fun.
The Chinese electronics Industry will ultimately succeed in the international market enhancing its creativity and competitiveness and driving the entire industry to new heights as a nation China should not passively rely on imported ships and other critical Technologies but gradually achieve independent Innovation and strengthen its core competitiveness through this approach.
It's time to make ASML go bankrupt.
Sell this technology way cheaper than ASML and teach them a good lesson.
Sell this technology way cheaper than ASML and teach them a good lesson.
https://www.digitimes.com/news/a20240429PD201/us-china-risc-v-samsung-ai-chip-foundry-expansion.html
From a longer-term perspective, If the US government enforces restrictions on RISC-V adoption, it could also negatively impact Samsung's foundry business, especially given the importance of the Chinese market in the company's efforts to expand its foundry market share.
It is reported that Samsung is conducting trial production of server chips for Baidu, a Chinese web giant, at its 4nm foundry line in Pyeongtaek, South Korea. Baidu has already invested in the RISC-V company StarFive. Additionally, Samsung's first 3nm customer is a Chinese ASIC manufacturer for Bitcoin mining.
From a longer-term perspective, If the US government enforces restrictions on RISC-V adoption, it could also negatively impact Samsung's foundry business, especially given the importance of the Chinese market in the company's efforts to expand its foundry market share.
It is reported that Samsung is conducting trial production of server chips for Baidu, a Chinese web giant, at its 4nm foundry line in Pyeongtaek, South Korea. Baidu has already invested in the RISC-V company StarFive. Additionally, Samsung's first 3nm customer is a Chinese ASIC manufacturer for Bitcoin mining.
TSMC as Apple as its main client for its 2nm and 3nm chips. Samsung's 3nm chips have no buyers. The RISC-V restrictions on China are going to screw up Samsung's 4nm foundry expansion.
They manufacture everything..https://keshtopatsspace.quora.com/US-Sanctions-Fail-Chinas-First-4nm-Chip-Enters-Commercial-Use
US Sanctions Fail! China's First 4nm Chip Enters Commercial Use.
Recently, the China Supercomputer Research Center announced that it has successfully packaged China's first 4nm chip and applied it to a computer cluster.
This breakthrough marks an important step forward in chip packaging technology in China, opening up new paths for Chinese chip performance. The importance of packaging technology lies in the fact that the current development of advanced processes is approaching a bottleneck.
TSMC and Samsung announced the start of mass production of 3nm processes last year, but Samsung's 3nm process yields are as low as 10-20%, costs are high, and no customers for 3nm processes have been announced yet.
TSMC also began mass production of the 3nm process at the end of last year, but its main customers are expected to be Apple only, and Apple will not start using the process to produce the A17 processor until June.
Unlike the past, this time the 3nm process was delayed by half a year, which some industry insiders believe is due to Apple's limited performance improvement and high cost of TSMC's 3nm process, forcing TSMC to improve to the second generation 3nm process = N3E before it can be adopted. As the development of advanced processes encountered obstacles, many chip companies such as Intel and TSMC jointly developed another way to improve chip performance, namely Chiplet technology.
Chiplet technology is divided into two types, one is the same kind of chip using a special way to package together, such as Apple's M1 Pro MAX, by linking two M1 chips to significantly improve performance; the other is to package the chips of different processes together to improve the overall performance by reducing the communication time between chips.
There are already companies in China developing both Chiplet technologies. A Shenzhen-based technology company has proposed a chip stacking technology that can integrate two 14nm chips to approach the performance of a 7nm process, and has been patented.
Note that the China was buying semiconductors from G-7 nations without any hiccups or hinderance, until Trump & Biden gang rocked this boat.
As soon as self sufficiency increases China will be able to produce chips at a cheaper price. This could drive American chip suppliers out of business altogether!
The US fails to understand that China is no India. China gives surprises. Wait for 2 years more as lithography machines are being build and then you see the fun.
The Chinese electronics Industry will ultimately succeed in the international market enhancing its creativity and competitiveness and driving the entire industry to new heights as a nation China should not passively rely on imported ships and other critical Technologies but gradually achieve independent Innovation and strengthen its core competitiveness through this approach.
That is why Samsung agressively downgrading its profit recently
Tiongs are truly no horse run!
we will see the real thing after it is being produced in mass.https://keshtopatsspace.quora.com/US-Sanctions-Fail-Chinas-First-4nm-Chip-Enters-Commercial-Use
US Sanctions Fail! China's First 4nm Chip Enters Commercial Use.
Recently, the China Supercomputer Research Center announced that it has successfully packaged China's first 4nm chip and applied it to a computer cluster.
This breakthrough marks an important step forward in chip packaging technology in China, opening up new paths for Chinese chip performance. The importance of packaging technology lies in the fact that the current development of advanced processes is approaching a bottleneck.
TSMC and Samsung announced the start of mass production of 3nm processes last year, but Samsung's 3nm process yields are as low as 10-20%, costs are high, and no customers for 3nm processes have been announced yet.
TSMC also began mass production of the 3nm process at the end of last year, but its main customers are expected to be Apple only, and Apple will not start using the process to produce the A17 processor until June.
Unlike the past, this time the 3nm process was delayed by half a year, which some industry insiders believe is due to Apple's limited performance improvement and high cost of TSMC's 3nm process, forcing TSMC to improve to the second generation 3nm process = N3E before it can be adopted. As the development of advanced processes encountered obstacles, many chip companies such as Intel and TSMC jointly developed another way to improve chip performance, namely Chiplet technology.
Chiplet technology is divided into two types, one is the same kind of chip using a special way to package together, such as Apple's M1 Pro MAX, by linking two M1 chips to significantly improve performance; the other is to package the chips of different processes together to improve the overall performance by reducing the communication time between chips.
There are already companies in China developing both Chiplet technologies. A Shenzhen-based technology company has proposed a chip stacking technology that can integrate two 14nm chips to approach the performance of a 7nm process, and has been patented.
Note that the China was buying semiconductors from G-7 nations without any hiccups or hinderance, until Trump & Biden gang rocked this boat.
As soon as self sufficiency increases China will be able to produce chips at a cheaper price. This could drive American chip suppliers out of business altogether!
The US fails to understand that China is no India. China gives surprises. Wait for 2 years more as lithography machines are being build and then you see the fun.
The Chinese electronics Industry will ultimately succeed in the international market enhancing its creativity and competitiveness and driving the entire industry to new heights as a nation China should not passively rely on imported ships and other critical Technologies but gradually achieve independent Innovation and strengthen its core competitiveness through this approach.
Chinese and china has a lot of hot air.
1st they say it can actually prdouce the DUv machine. But it just theory.
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